document number: 90365 www.vishay.com s11-1063-rev. c, 30-may-11 1 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 power mosfet irfz14s, irfz14l, sihfz14s, sihfz14l vishay siliconix features ? halogen-free according to iec 61249-2-21 definition ? advanced process technology ? surface mount (irfz14s, sihfz14s) ? low-profile through-hole (irfz14l, sihfz14l) ? 175 c operating temperature ?fast switching ? compliant to rohs directive 2002/95/ec description third generation power mosfets from vishay utilize advanced processing techniques to achieve extermely low on resistance per silicon area. this benefit, combined with the fast switching speed and ruggedized device design that power mosfets are well known for, provides the designer with an extermely efficient reliabel deviece for use in a wide variety of applications. the d 2 pak is a surface mount power package capable of accommodating die sizes up to hex-4. it provides the highest power capab ility and lowest possible on-resistance in any existing surface mount package. the d 2 pak is suitable for high current app lications because of its low internal connection resistance and can dissipate up to 2.0 w in a typical surface mount application. the through-hole version (irfz14l, sihfz44l) is available for low profile applications. note a. see device orientation. notes b. repetitive rating; pu lse width limited by maximum junction temperature (see fig. 11). c. v dd = 25 v, starting t j = 25 c, l = 548 h, r g = 25 ? , i as = 10 a (see fig. 12). d. i sd ? 10 a, di/dt ? 90 a/s, v dd ? v ds , t j ? 175 c. e. 1.6 mm from case. f. when mounted on 1" square pcb (fr-4 or g-10 material). product summary v ds (v) 60 r ds(on) ( ? )v gs = 10 v 0.20 q g (max.) (nc) 11 q gs (nc) 3.1 q gd (nc) 5.8 configuration single n-channel mosfet g d s d 2 pak (to-263) g d s i 2 pak (to-262) g d s ordering information package d 2 pak (to-263) d 2 pak (to-263) i 2 pak (to-262) lead (pb)-free and halogen-fr ee sihfz14s-ge3 SIHFZ14STRL-GE3 a sihfz14l-ge3 lead (pb)-free irfz14spbf irfz14strlpbf a irfz14lpbf sihfz14s-e3 sihfz14stl-e3 a sihfz14l-e3 absolute maximum ratings (t c = 25 c, unless otherwise noted) parameter symbol limit unit drain-source voltage v ds 60 v gate-source voltage v gs 20 continuous drain current v gs at 10 v t c = 25 c i d 10 a t c = 100 c 7.2 pulsed drain current a i dm 40 linear derating factor 0.29 w/c single pulse avalanche energy b e as 47 mj maximum power dissipation t c = 25 c p d 43 w maximum power dissipation (pcb mount) e t a = 25 c 3.7 peak diode recovery dv/dt c dv/dt 4.5 v/ns operating junction and storage temperature range t j , t stg - 55 to + 175 c soldering recommendations (p eak temperature) for 10 s 300 d * pb containing terminations are not rohs compliant, exemptions may apply
www.vishay.com document number: 90365 2 s11-1063-rev. c, 30-may-11 this document is subject to change without notice. the products described herein and this document ar e subject to specific disclaimers, set forth at www.vishay.com/doc?91000 irfz14s, irfz14l, sihfz14s, sihfz14l vishay siliconix note a. when mounted on 1" square pcb (fr-4 or g-10 material). notes a. repetitive rating; pulse widt h limited by maximum junction temperature (see fig. 11). b. pulse width ? 300 s; duty cycle ? 2 %. thermal resistance ratings parameter symbol typ. max. unit maximum junction-to-ambient (pcb mount) a r thja -40 c/w maximum junction-to-case (drain) r thjc -3.5 specifications (t j = 25 c, unless otherwise noted) parameter symbol test condi tions min. typ. max. unit static drain-source brea kdown voltage v ds v gs = 0, i d = 250 a 60 - - v v ds temperature coefficient ? v ds /t j reference to 25 c, i d = 1 ma - 0.063 - v/c gate-source threshold voltage v gs(th) v ds = v gs , i d = 250 a 2.0 - 4.0 v gate-source leakage i gss v gs = 20 v - - 100 na zero gate voltage drain current i dss v ds = 60 v, v gs = 0 v - - 25 a v ds = 48 v, v gs = 0 v, t j = 150 c - - 250 drain-source on-state resistance r ds(on) v gs = 10 v i d = 6.0 a b --0.2 ? forward transconductance g fs v ds = 25 v, i d = 6.0 a b 2.4 - - s dynamic input capacitance c iss v gs = 0 v, v ds = 25 v, f = 1.0 mhz, see fig. 5 - 300 - pf output capacitance c oss - 160 - reverse transfer capacitance c rss -29- total gate charge q g v gs = 10 v i d = 10 a, v ds = 48 v, see fig. 6 and 13 b --11 nc gate-source charge q gs --3.1 gate-drain charge q gd --5.8 turn-on delay time t d(on) v dd = 30 v, i d = 10 a, r g = 24 ? , r d = 2.7 ? , see fig. 10 b -10- ns rise time t r -50- turn-off delay time t d(off) -13- fall time t f -19- internal source inductance l s between lead, and center of die contact - 7.5 - nh drain-source body diode characteristics continuous source-dr ain diode current i s mosfet symbol showing the integral reverse p - n junction diode --10 a pulsed diode forward current a i sm --40 body diode voltage v sd t j = 25 c, i s = 10 a, v gs = 0 v b --1.6v body diode reverse recovery time t rr t j = 25 c, i f = 10 a, di/dt = 100 a/s b - 70 140 ns body diode reverse recovery charge q rr - 200 400 c forward turn-on time t on intrinsic turn-on time is negligible (turn-on is dominated by l s and l d ) s d g
document number: 90365 www.vishay.com s11-1063-rev. c, 30-may-11 3 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 irfz14s, irfz14l, sihfz14s, sihfz14l vishay siliconix typical characteristics (25 c, unless otherwise noted) fig. 1 - typical output characteristics fig. 2 - typical output characteristics fig. 3 - typical transfer characteristics fig. 4 - normalized on-r esistance vs. temperature
www.vishay.com document number: 90365 4 s11-1063-rev. c, 30-may-11 this document is subject to change without notice. the products described herein and this document ar e subject to specific disclaimers, set forth at www.vishay.com/doc?91000 irfz14s, irfz14l, sihfz14s, sihfz14l vishay siliconix fig. 5 - typical capacitance vs. drain-to-source voltage fig. 6 - typical gate charge vs. gate-to-source voltage fig. 7 - typical source-drain diode forward voltage fig. 8 - maximum safe operating area
document number: 90365 www.vishay.com s11-1063-rev. c, 30-may-11 5 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 irfz14s, irfz14l, sihfz14s, sihfz14l vishay siliconix fig. 9 - maximum drain current vs. case temperature fig. 10a - switching time test circuit fig. 10b - switching time waveforms fig. 11 - maximum effective transient thermal impedance, junction-to-case pulse width 1 s duty factor 0.1 % r d v gs r g d.u.t. 10 v + - v ds v dd v ds 90 % 10 % v gs t d(on) t r t d(off) t f
www.vishay.com document number: 90365 6 s11-1063-rev. c, 30-may-11 this document is subject to change without notice. the products described herein and this document ar e subject to specific disclaimers, set forth at www.vishay.com/doc?91000 irfz14s, irfz14l, sihfz14s, sihfz14l vishay siliconix fig. 12a - unclamped inductive test circuit fig. 12b - unclamped inductive waveforms fig. 12c - maximum avalanche energy vs. drain current fig. 13a - basic gate charge waveform fig. 13b - gate charge test circuit r g i as 0.01 t p d.u.t. l v ds + - v dd 10 v var y t p to obtain required i as i as v ds v dd v ds t p q gs q gd q g v g charge 10 v d.u.t. 3 ma v gs v ds i g i d 0.3 f 0.2 f 50 k 12 v current regulator current sampling resistors same type as d.u.t. + -
document number: 90365 www.vishay.com s11-1063-rev. c, 30-may-11 7 this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 irfz14s, irfz14l, sihfz14s, sihfz14l vishay siliconix fig. 14 - for n-channel vishay siliconix maintains worldw ide manufacturing capability. prod ucts may be manufactured at on e of several qualified locatio ns. reliability data for silicon technology and package reliability represent a composite of all qualified locations. for related documents su ch as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?90365 . p.w. period di/dt diode recovery dv/dt ripple 5 % body diode forward drop re-applied voltage rever s e recovery current body diode forward current v gs = 10 v a i s d driver gate drive d.u.t. l s d waveform d.u.t. v d s waveform inductor current d = p.w. period + - + + + - - - peak dio d e recovery d v/ d t test circuit v dd ? dv/dt controlled by r g ? driver s ame type a s d.u.t. ? i s d controlled by duty factor d ? d.u.t. - device under te s t d.u.t. circuit layout con s ideration s ? low s tray inductance ? g round plane ? low leakage inductance current tran s former r g note a. v gs = 5 v for logic level device s v dd
document number: 91364 www.vishay.com revision: 15-sep-08 1 package information vishay siliconix to-263ab (high voltage) notes 1. dimensioning and toler ancing per asme y14.5m-1994. 2. dimensions are shown in millimeters (inches). 3. dimension d and e do not include mold flash. mold flash shal l not exceed 0.127 mm (0.005") per side. these dimensions are me asured at the outmost extremes of the plastic body at datum a. 4. thermal pad contour optional within dimension e, l1, d1 and e1. 5. dimension b1 and c1 apply to base metal only. 6. datum a and b to be determined at datum plane h. 7. outline conforms to jedec outline to to-263ab. 5 4 1 3 l1 l2 d b b e h b a detail a a a c c2 a 2 x e 2 x b 2 2 x b 0.010 a b mm 0.004 b m base metal plating b 1, b 3 ( b , b 2) c1 (c) section b - b and c - c scale: none lead tip 4 34 (dat u m a) 2 c c b b 5 5 v ie w a - a e1 d1 e 4 4 b h seating plane ga u ge plane 0 to 8 detail ?a? rotated 90 cw scale 8 :1 l3 a1 l4 l millimeters inches millimeters inches dim. min. max. min. max. dim. min. max. min. max. a 4.06 4.83 0.160 0.190 d1 6.86 - 0.270 - a1 0.00 0.25 0.000 0.010 e 9.65 10.67 0.380 0.420 b 0.51 0.99 0.020 0.039 e1 6.22 - 0.245 - b1 0.51 0.89 0.020 0.035 e 2.54 bsc 0.100 bsc b2 1.14 1.78 0.045 0.070 h 14.61 15.88 0.575 0.625 b3 1.14 1.73 0.045 0.068 l 1.78 2.79 0.070 0.110 c 0.38 0.74 0.015 0.029 l1 - 1.65 - 0.066 c1 0.38 0.58 0.015 0.023 l2 - 1.78 - 0.070 c2 1.14 1.65 0.045 0.065 l3 0.25 bsc 0.010 bsc d 8.38 9.65 0.330 0.380 l4 4.78 5.28 0.188 0.208 ecn: s-82110-rev. a, 15-sep-08 d w g: 5970
document number: 91 000 www.vishay.com revision: 11-mar-11 1 disclaimer legal disclaimer notice vishay all product, product specifications and data ar e subject to change without notice to improve reliability, function or design or otherwise. vishay intertechnology, inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectivel y, vishay), disclaim any and all liability fo r any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicab le law, vishay disc laims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, incl uding without limitation specia l, consequential or incidental dama ges, and (iii) any and all impl ied warranties, including warran ties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of pro ducts for certain types of applications are based on vishays knowledge of typical requirements that are often placed on vishay products in gene ric applications. such statements are not binding statements about the suitability of products for a partic ular application. it is the customers responsibility to validate that a particu lar product with the properties described in th e product specification is su itable for use in a particul ar application. parameters provided in datasheets an d/or specifications may vary in different applications and perfo rmance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify vishays term s and conditions of purchase, including but not limited to the warranty expressed therein. except as expressly indicated in writing, vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the vishay product co uld result in person al injury or death. customers using or selling vishay products not expressly indicated for use in such applications do so at their own risk and agr ee to fully indemnify and hold vishay and it s distributors harmless from and against an y and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that vis hay or its distributor was negligent regarding the design or manufact ure of the part. please contact authorized vishay personnel t o obtain written terms and conditions regarding products designed fo r such applications. no license, express or implied, by estoppel or otherwise, to any intelle ctual property rights is gran ted by this document or by any conduct of vishay. product names and markings noted herein may be trademarks of their respective owners.
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